pb rohs emk12g2h-19.960m emk12 g 2 h -19.960m series rohs compliant (pb-free) 4 pad 5mm x 7mm smd 2.5vdc lvcmos mems oscillator frequency tolerance/stability 100ppm maximum over -40c to +85c duty cycle 50 5(%) nominal frequency 19.960mhz output control function tri-state (disabled output: high impedance) electrical specifications nominal frequency 19.960mhz frequency tolerance/stability 100ppm maximum over -40c to +85c (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operating temperature range, supply voltage change, output load change, first year aging at 25c, 260c reflow, shock, and vibration) aging at 25c 1ppm maximum first year operating temperature range -40c to +85c supply voltage 2.5vdc 5% input current 17ma maximum output voltage logic high (voh) 90% of vdd minimum (ioh=-8ma) output voltage logic low (vol) 10% of vdd maximum (iol=+8ma) rise/fall time 2nsec maximum (measured from 20% to 80% of waveform) duty cycle 50 5(%) (measured at 50% of waveform) load drive capability 15pf maximum output logic type cmos output control function tri-state (disabled output: high impedance) output control input voltage +0.7vdd minimum or no connect to enable output, +0.3vdd maximum to disable output peak to peak jitter (tpk) 250psec maximum, 100psec typical start up time 50msec maximum storage temperature range -55c to +125c environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 2, hbm 2000v flammability ul94-v0 mechanical shock mil-std-883, method 2002, condition g, 30,000g moisture resistance mil-std-883, method 1004 moisture sensitivity level j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 (four i/o pads on bottom of package only) temperature cycling mil-std-883, method 1010, condition b thermal shock mil-std-883, method 1011, condition b vibration mil-std-883, method 2007, condition a, 20g www.ecliptek.com | specification subject to change without notice | rev k 8/13/2010 | page 1 of 5
emk12g2h-19.960m mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state (high impedance) 2 ground 3 output 4 supply voltage line marking 1 xxxx or xxxxx xxxx or xxxxx=ecliptek manufacturing lot code 2.88 1.81 2.0 (x4) 2.2 (x4) www.ecliptek.com | specification subject to change without notice | rev k 8/13/2010 | page 2 of 5 5.00 0.15 7.00 0.15 0.85 0.15 0.08 max 2.60 0.15 1.40 0.10 (x4) 1.20 0.10 (x4) 2.1 2 1 3 4 1.70 r0.70 0.10 5.08 0.10 a note a: center paddle is connected inter nally to oscillator g round (p ad 2). c0.25 0.10 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
emk12g2h-19.960m www.ecliptek.com | specification subject to change without notice | rev k 8/13/2010 | page 3 of 5 output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% of w a v ef or m 50% of w a v ef or m 20% of w a v ef or m f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input supply v oltage (v dd ) t est cir cuit f or cmos output output t r i-state or p o w er do wn ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods emk12g2h-19.960m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev k 8/13/2010 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods emk12g2h-19.960m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev k 8/13/2010 | page 5 of 5
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